CVE-2023-33063

unknown KEV

Published 2023-12-05 · Modified 2023-12-05

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CVSS v3

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CVSS v4 NEW

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not yet in upstream

VIR risk

1.5

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

CISA KEV

Vendor: Qualcomm
Product: Multiple Chipsets
Due date: 2023-12-26

Predictions

Exploit likelihood

99%

Patch ETA

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Heuristic predictions, AS-IS, for prioritization only.

Mitigations

vendor Authored 2026-05-27

{Vendor advisory: cisa-kev — This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063}

Exploits

Public proof-of-concept code below. AS-IS, for defenders and authorised testing only.

References

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063

Community-verified mitigations for this CVE will appear above when contributors publish them.

Verify integrity in audit chain (admin only). AS-IS.